grinding-wheel-for-led-wafers -

In the most frequent circumstances, the LED wafers applied in Semi-Conductor industry are mainly made of GaAs or Sapphire-crystal material, during the Wafers thickness reduction process (say the thickness thinning process) must in need of Diamond Grinding Wheels.
The surface of LED Wafers Grinding should be in Smooth Procedures, and definitely should not have any Cracks on the Wafers; also the Parallelism between the two sides of the LED wafers must be very precise.

In recent years, our Diamond Grinding Wheels used for Lapping and Thinning GaAs or Sapphire-crystal LED Wafers in Semi-conductor Industry which in our brand of "CO-MAX" had been widely acknowledged. Through continuous improvement and technical innovations to our general performances, "CO-MAX" Diamond Grinding Wheels for LED Wafers have been reached to the International Top-Quality and we could ensure the Satisfied Usages comparing to the Germany/Japanese/American/Korean imported Grinding Wheels applied in Wafers-Lapping-Machine.

*** Features: ***

1. The Most Advanced Bonded and Manfacturing Technology to Guarantee the Performances;

2. Excellent Self-Sharpness Capabilities to Avoid the risk of wafers breaking;

3. The Most Accurate Diamond Graded-Powder and the Most Strictly Production Control to Ensure the Quality;

4. The Grinding Wheels for LED Wafers of "CO-MAX" process the Following Characteristics:
(1) High Grinding Efficiency & Longevity of Diamond Grinding Wheels;
(2) High Surface Lapping & Thinning but Without Dressing Needed;
(3) Extremely Low Risk of Wafers Damage & Reduced Grinding Resistance;
(4) Self-Production and Costs-Stictly Control, Leads to the Good Costs with Prices.

Diamond Grinding Wheels for LED Wafers Lapping in Semi-Conductor Industry
Items	Specification(mm)	Shape	Technique Data
1	D302 x T35 x H110 x W7(3) x X7	6A2	Diamond Material Vitrified Bond; For Sapphire-Crystal / GaAs Wafer Material
2	D265 x T46.6 x H80 x W7(3) x X7
3	D255 x H155 x W4 x X8(1)	6A9S	For Recycling of Wafers
4	D255 x H155 x W3-4 x X10(2)	6A9S	For Sapphire-Crystal
5	D150 x M12 x W3-10 x X5-10	6A2	For Sapphire-Crystal / GaAs Wafer Material
6	D150 x M12 x U8 x X3 x L20	6A9	For Surface Grinding of GaAs Wafer Material
7	Custom Production: According to your Samples/Drawings.